QP450 Vision‑Guided Automatic Solder Paste Stencil Printer | QiHe

QP450+automatic soldering machine (fully automatic vision solder paste printer )stencil printer machine screen printer machine stencil printer .

描述

QP450 vision‑aligned automatic solder paste printer for SMT PCB assembly. Optical mark‑point alignment, multi‑mode stencil cleaning. Ideal for medium‑precision PCB production. Get your quote.

QP450+automatic soldering machine (fully automatic vision solder paste printer )stencil printer machine screen printer machine stencil printer .
The whole machine is fully controlled by servo system.Automatic pressure feedback system.Multifunctional image processing system.
Precise PCB transportation system.Intelligent PCB holding device.Automatic steel mesh positioning module.
Automatic and effective steel mesh cleaning system.User-friendly operation interface.

The QP450 vision‑guided automatic solder paste printer brings optical alignment for medium‑precision SMT production. Built‑in vision camera realizes stencil‑PCB mark‑point matching, greatly reducing manual alignment error for complex circuit boards.

Dual‑linear‑guide printing carriage ensures even paste deposition. Multiple cleaning modes (dry, wet, vacuum) keep stencil apertures unblocked during long‑time mass production. Operators can store and quickly recall recipe parameters for different PCB projects to shorten product change‑over time.

This vision stencil printer works well for power supply boards, sensor modules and LED driver boards. It is frequently combined with our pick‑and‑place machines and reflow ovens to build complete compact SMT assembly lines.

We offer machine calibration training and routine‑maintenance guidance. If you have special requirements for PCB size or printing accuracy, custom configuration options are available.

PCB ParametersⅠ
Maximum board size(X x Y)450mm x 350mm
Minimum board size(Y x X)50mm x 50mm
PCB thickness0.4mm~6mm
WarpageMax. PCB ≤1%Diagonal
Maximum board weight6Kg
Board margin gapConfiguration to 3mm
Maximum bottom gap20mm
Transfer speed1500mm/s(Max)
Transfer height from the ground900±40mm
Transfer orbit directionLeft-Right,Right-Left,Left-Left,Right-Right
Transfer modeOne stage orbit
PCB damping methodProgrammable flexible side pressure,
(Optional: 1,Bottom integral suction cavity vacuum,
2.Multipoint partial vacuum at the bottom;
3. Edge locking and Substrate clamping)
Support methodMagnetic thimble, Equal high block,Vacuum suction cavity; Special workpiece fixture
Printing parametersⅡ
Printing headLinear motor type close loop printing head
Template frame size470mm x 370mm~737 mm x 737 mm
Maximum printing area(X x Y)450mm x 350mm
Squegee typeSteel scraper/Glue scraper
(Angel 45°/50°/60° matching the printing process)
Squegee length220mm~ 500mm
Squegee height65±1mm
Squegee thickness0.25mm Diamond-like carbon coating
Printing modeSingle or double scraper printing
Demoulding length0.02 mm – 12 mm
Printing speed0 ~ 200 mm/s
Printing pressure0.5kg – 10Kg
Printing stroke±200 mm (From the center)
Field of view6.4mm x 4.8mm
Platform adjustment rangeX.Y:±7.0mm,θ:±2.0°
Benchmark point typeStandard shape benchmark point(SMEMA standard),
solder pad/openings
Camera systemIndependent camera,upwards/
downwards imaging vision system
Performance parametersⅢ
Repetition precision of image calibration±15.0micron @6 σ,Cpk ≥ 2.0
Repetition precision of printing±20.0micron @6 σ,Cpk ≥ 2.0
Cycle time<7s
Product changeover<5mins
Power supplyAC220V±10%,50/60HZ,15A
Air supply4~6Kg/cm2, 10.0 Diameter of the tube
Gas consumptionAbout 5L/min
Operating systemWindows XP
External dimension1140mm(L) x 1450mm(W) x 1480mm(H)
(Without light,monitor and keyboard)
Machine weightAround 1000Kg
Temperature and humidity control module(optional)
Environment temperature23±3˚C
Relative humidity45-70%RH4