{"id":2179,"date":"2022-11-04T14:58:00","date_gmt":"2022-11-04T06:58:00","guid":{"rendered":"https:\/\/www.qhsmt.com\/?p=2179"},"modified":"2022-11-01T13:53:56","modified_gmt":"2022-11-01T05:53:56","slug":"smt-pick-and-place-machine-how-to-design-multi-layer-pcb","status":"publish","type":"post","link":"https:\/\/www.qhsmt.com\/zh\/2022\/11\/04\/smt-pick-and-place-machine-how-to-design-multi-layer-pcb\/","title":{"rendered":"How to design multi layer PCB board for SMT PNP"},"content":{"rendered":"

Today author from qihe smt pick and place machine tell you about rapid proofing of multi-layer pcb boards for smt pick and place machine has the following difficulties:<\/p>\n\n\n\n

\"Smt<\/figure>\n\n\n\n
\"qihe<\/figure>\n\n\n\n

Interlayer alignment Due to the large number of layers in a multi-layer PCB board. <\/p>\n\n\n\n

Most users have higher and higher calibration requirements for PCB layers.<\/p>\n\n\n\n

Typically, the alignment tolerance between layers is controlled at 75 microns. Considering the large unit size of the multi-layer PCB board.<\/p>\n\n\n\n

The high temperature and humidity in the graphics conversion workshop. The dislocation overlap caused by the inconsistency of different core boards.And the interlayer positioning method.<\/p>\n\n\n\n

The alignment control of the multi-layer PCB board is more and more difficult.<\/p>\n\n\n\n

Internal circuit production The multi-layer pcb board adopts high TG, high speed, high frequency, thick copper, thin dielectric layer and other materials.<\/p>\n\n\n\n

Which puts forward high requirements for internal circuit production and graphic size control. For example, the integrity of impedance signal transmission adds to the difficulty of internal circuit fabrication. <\/p>\n\n\n\n

In the rapid proofing process of the pcb board, the width and line spacing are small, <\/p>\n\n\n\n

open and short circuits are added, short circuits are added, <\/p>\n\n\n\n

And the pass rate is low; there are many signal layers of thin lines, and the detection probability of AOI leakage in the inner layer is increased; <\/p>\n\n\n\n

the inner core board is thin, easy to wrinkle, and poor exposure. , <\/p>\n\n\n\n

It is easy to bend when the etching machine is used; the high-level plate is mostly a system board, the unit size is large, and the product scrapping cost is high.<\/p>\n\n\n\n

Compression manufacturing In the process of rapid proofing of pcb boards,<\/p>\n\n\n\n

many inner core boards and prepreg boards are superimposed, <\/p>\n\n\n\n

and defects such as sliding plates, delamination, resin voids and bubble residues simply appear in stamping production. <\/p>\n\n\n\n

In the design of the laminate structure, the heat resistance, pressure resistance, <\/p>\n\n\n\n

glue content and dielectric thickness of the material should be fully considered, <\/p>\n\n\n\n

and a reasonable multi-layer circuit board material pressing plan should be formulated. <\/p>\n\n\n\n

Due to the large number of layers of the pcb board, the expansion and contraction control and size coefficient compensation cannot be kept consistent, <\/p>\n\n\n\n

And the thin interlayer insulating layer is simple, which leads to the failure of the interlayer reliability test.<\/p>\n\n\n\n

Drilling In the process of rapid proofing of pcb boards, some boards have added difficulty in drilling roughness, drilling burrs and decontamination. <\/p>\n\n\n\n

The number of layers is large, the total copper thickness and plate thickness are accumulated, <\/p>\n\n\n\n

And the drilling tool is easy to break; the CAF failure problem cause<\/p>\n\n\n\u9605\u8bfb\u66f4\u591a\uff1aHow to design multi layer PCB board for SMT PNP<\/span><\/a>\n\n\n

you can choose a reflow oven to meets your need like qfr630,qrf835,qrf1235
stencil printer model qh3040,qp3250,qfa5060
Also we have different kinds of smt pick and place machine like tvm802a,tvm802b,tvm802ax,tvm802bx,tvm925s,tvm926s,ql41,qm61,qm62,qm81,qm10<\/p>\n\n\n\n

Qihe SMT pick and place machine catalog<\/h2>\n\n\n