{"id":2207,"date":"2022-11-10T14:30:00","date_gmt":"2022-11-10T06:30:00","guid":{"rendered":"https:\/\/www.qhsmt.com\/?p=2207"},"modified":"2022-11-01T13:36:59","modified_gmt":"2022-11-01T05:36:59","slug":"smt-pick-and-place-machine-skills-about-heat-dissipation-of-pcb-design-in-smt-process","status":"publish","type":"post","link":"https:\/\/www.qhsmt.com\/zh\/2022\/11\/10\/smt-pick-and-place-machine-skills-about-heat-dissipation-of-pcb-design-in-smt-process\/","title":{"rendered":"Skills about heat dissipation of PCB design in SMT process"},"content":{"rendered":"

There are some skills about heat dissipation of PCB circuit boards before you use the smt pick and place machine. qihe smt will sharing you some tips today .<\/p>\n\n\n\n

Qhsmt Skills about heat dissipation of PCB circuit boards
For any electronic product, it is a very harmful thing to not be able to dissipate heat when it is hot, not only for the product but also for the human being. If you do not find a way to dissipate heat from electronic equipment, the temperature of the equipment will continue to rise, which will directly lead to the overheating of the components of the equipment. In severe cases, the components of the equipment will explode. Therefore, there must be a good treatment method for the heat dissipation of electronic PCB circuit boards. Let’s take a look at the technical points.<\/p>\n\n\n\n

a. When designing the PCB, the project has a lot of uniform distribution of power. The reason for uniform distribution is that if the power is concentrated, it is easy to generate heat and difficult to dissipate heat, which in turn affects the circuit board. use. Therefore, it is recommended to avoid the concentration of hot spots on the PCB as much as possible when designing.<\/p>\n\n\n\n

b. Design some components with high power consumption to places where it is easy to dissipate heat, and avoid the most central position as much as possible. Because the PCB circuit board will need to assemble a lot of components when it is assembled, if the components with high power consumption are installed in the most, then some small parts around it will also generate some heat, which will not dissipate the heat even more. Therefore, it is necessary to reasonably design those components with high power consumption in a position where it is easy to dissipate heat.<\/p>\n\n\n\n

c. On the components, distinguish which ones have low calorific value, poor heat resistance, large calorific value and good heat resistance. For example, large-scale integrated circuits and power transistors have high heat generation and good heat resistance, and these should be designed to be placed downstream of the cold air flow. Such as electrolytic capacitors, small-scale integrated circuits and small transistors are those with low heat generation and poor heat resistance, which can be designed above the most of the cooling airflow.<\/p>\n\n\n\n

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you can choose a reflow oven to meets your need like qfr630,qrf835,qrf1235
stencil printer model qh3040,qp3250,qfa5060
Also we have different kinds of smt pick and place machine like tvm802a,tvm802b,tvm802ax,tvm802bx,tvm925s,tvm926s,ql41,qm61,qm62,qm81,qm10<\/p>\n\n\n