{"id":3209,"date":"2023-02-27T16:53:00","date_gmt":"2023-02-27T08:53:00","guid":{"rendered":"https:\/\/www.qhsmt.com\/?p=3209"},"modified":"2023-03-02T13:56:51","modified_gmt":"2023-03-02T05:56:51","slug":"smt-pick-and-place-machine-copper-thickness-production-in-pcb-hole-and-explanation-of-problems","status":"publish","type":"post","link":"https:\/\/www.qhsmt.com\/zh\/2023\/02\/27\/smt-pick-and-place-machine-copper-thickness-production-in-pcb-hole-and-explanation-of-problems\/","title":{"rendered":"Copper Thickness Production in PCB Hole and Explanation of Problems"},"content":{"rendered":"

Today author from QiHe smt pick and place machine sharing you with Copper Thickness Production in PCB Hole and Explanation of Problems.
PCB circuit board double-sided circuit board will need to sink copper in the hole,
Make the via hole have copper and become a via hole.<\/p>\n\n\n\n

However, during the production process, the manufacturer will occasionally find that there is no copper in the hole after the copper sinking or the copper is not saturated.
Now the author of qhsmt will briefly describe several reasons.
QHSMT is an enterprise specializing in the production of SMT equipment, like pick and place machine \uff0creflow oven\uff0cstencil printer \uff0cwelcome to send inquiry.<\/p>\n\n\n\n

The reasons for the occurrence of holes without copper are nothing more than:<\/p>\n\n\n\n

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  1. Drilling dust plugs the hole or the hole is thick.<\/li>\n\n\n\n
  2. There are bubbles in the potion when copper is deposited, and copper is not deposited in the hole.<\/li>\n\n\n\n
  3. There is line ink in the hole, no protective layer is applied, and there is no copper in the hole after etching.<\/li>\n\n\n\n
  4. The acid-base potion in the hole is not cleaned after copper sinking or electroplating, and the parking time is too long, resulting in slow corrosion.<\/li>\n\n\n\n
  5. Improper operation, staying too long in the micro-etching process.<\/li>\n\n\n\n
  6. The pressure of the punching plate is too high,
    (the designed punching hole is too close to the conductive hole) and the center is disconnected neatly.<\/li>\n\n\n\n
  7. Poor penetration of electroplating chemicals (tin, nickel).
    Improvements are made for these 7 reasons for the occurrence of hole-free copper problems.<\/li>\n\n\n\n
  8. Add high-pressure water washing and desmearing processes to the holes that are prone to dust (such as 0.3mm or less hole diameter including 0.3mm).<\/li>\n\n\n\n
  9. Improve the potion activity and vibration effect.<\/li>\n\n\n\n
  10. Change the printing screen and alignment film.<\/li>\n\n\n\n
  11. Extend the washing time and stipulate how many hours to complete the graphics transfer.<\/li>\n\n\n\n
  12. Set the timer. 6. Add explosion-proof holes. Reduce the stress on the board.<\/li>\n\n\n\n
  13. Regular penetration test.
    Then, knowing that there are so many reasons that lead to no copper open circuit in the hole,
    do we still need to slice and analyze it every time?
    Whether it should go to preventive supervision in advance.<\/li>\n<\/ol>\n\n\n