{"id":5556,"date":"2024-01-17T16:01:00","date_gmt":"2024-01-17T08:01:00","guid":{"rendered":"https:\/\/www.qhsmt.com\/?p=5556"},"modified":"2024-01-04T15:55:21","modified_gmt":"2024-01-04T07:55:21","slug":"smt-pick-and-place-whats-the-difference-between-smd-component-embossed-tape-vs-paper-tape","status":"publish","type":"post","link":"https:\/\/www.qhsmt.com\/zh\/2024\/01\/17\/smt-pick-and-place-whats-the-difference-between-smd-component-embossed-tape-vs-paper-tape\/","title":{"rendered":"What’s the difference between SMD\u00a0component embossed tape vs paper tape"},"content":{"rendered":"

Each product has its own packaging method and packaging identification. For students who have not come into contact with a complete Murata capacitor packaging disk, the seemingly very simple Murata chip electronic material packaging disk actually has a lot of tricks. The following is an explanation based on the narrow embossed tape corresponding to the 0402 size in SMD electronic materials.Today qihe smt pick and place machine sharing what’s the embossed tape vs paper tape difference<\/p>\n\n\n\n

SMD electronic material packaging based on the concept of environmental protection has the following advantages:<\/p>\n\n\n\n

Environmental protection response: reduce the use of packaging resources, reduce packaging waste, and reduce energy consumption during transportation.<\/p>\n\n\n\n

To save mounting space: reduce the space used for storage and reduce the space used by the placement machine material machine<\/p>\n\n\n\n

Dust-free mounting response: Prevent paper scraps and dust from causing problems at the welding joint, and prevent static electricity from causing picking problems.<\/p>\n\n\n\n

Mounting stability response: high stability of taping cavity, stable supply of ultra-small chip components<\/p>\n\n\n\n

Take the following example as an example:<\/p>\n\n\n\n

\"pick&place<\/figure>\n\n\n\n

Compared with W8P2 paper tape, W4P1 embossed tape reduces the packaging material size (in terms of surface area ratio) of the same component to 1\/4. This greatly reduces the waste of packaging materials during the placement process. In addition, by reducing the packaging size, transportation energy consumption and carbon dioxide emissions are also reduced accordingly.<\/p>\n\n\n\n

For sheet component packaging of the same size, the embossed tape W4P1 is narrower than the W8P2 paper tape, and the spacing is correspondingly reduced, so that the tape area can be more fully utilized. This greatly reduces the storage space of components.<\/p>\n\n\n\n

\",smt<\/figure>\n\n\n\n

When chip components packed with paper tape are put into the placement machine, the fluff and dust of the paper tape may cause defects in the welds of ultra-small components. Embossed tape made of plastic can solve this problem. It can provide a dust-free space for the placement of ultra-small chip components, meet the different needs of various circuit board placements, and is very flexible.<\/p>\n\n\n\n

Because embossed tape generates less lint and paper dust than existing paper tape packaging, it can prevent cavities from clogging. This solves the picking problem.<\/p>\n\n\n\u9605\u8bfb\u66f4\u591a\uff1aWhat’s the difference between SMD\u00a0component embossed tape vs paper tape<\/span><\/a>\n\n\n

Best seller SMT Machine \uff1aQihe smt line products<\/h2>\n\n\n