{"id":6881,"date":"2025-12-27T17:02:11","date_gmt":"2025-12-27T09:02:11","guid":{"rendered":"https:\/\/www.qhsmt.com\/?p=6881"},"modified":"2025-12-31T09:34:57","modified_gmt":"2025-12-31T01:34:57","slug":"the-application-of-selective-soldering-in-smt-surface-mount-technology","status":"publish","type":"post","link":"https:\/\/www.qhsmt.com\/zh\/2025\/12\/27\/the-application-of-selective-soldering-in-smt-surface-mount-technology\/","title":{"rendered":"The application of selective soldering in SMT (Surface Mount Technology)"},"content":{"rendered":"

Selective soldering is a localized soldering process used in the post-SMT assembly stage. It is used for precisely soldering solder joints on PCBs that are unsuitable for wave soldering or reflow soldering (such as through-hole components, irregularly shaped components, and areas around heat-sensitive components), offering both flexibility and reliability.<\/p>\n\n\n\n

Key Process Steps:<\/mark>
Flux Application:<\/strong> Flux is precisely sprayed onto the target solder joints through a nozzle, wetting only the areas to be soldered.
Preheating: <\/strong>The PCB is locally preheated to activate the flux and prevent thermal shock during soldering.
Dip Soldering \/ Drag Soldering:<\/strong> The solder nozzle rises, allowing the solder to wet the solder joints; or the PCB moves, dragging the solder joints across the nozzle surface to form full solder joints.
Cooling: <\/strong>The solder joints are cooled naturally or forcibly to ensure a stable crystal structure.<\/p>\n\n\n\n

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