Selective soldering is a localized soldering process used in the post-SMT assembly stage. It is used for precisely soldering solder joints on PCBs that are unsuitable for wave soldering or reflow soldering (such as through-hole components, irregularly shaped components, and areas around heat-sensitive components), offering both flexibility and reliability.
Key Process Steps:
Flux Application: Flux is precisely sprayed onto the target solder joints through a nozzle, wetting only the areas to be soldered.
Preheating: The PCB is locally preheated to activate the flux and prevent thermal shock during soldering.
Dip Soldering / Drag Soldering: The solder nozzle rises, allowing the solder to wet the solder joints; or the PCB moves, dragging the solder joints across the nozzle surface to form full solder joints.
Cooling: The solder joints are cooled naturally or forcibly to ensure a stable crystal structure.
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Nitrogen generator, used for selective welding -
Desktop selection welding QSO-300B
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Desktop Selective Wave Soldering Machine QH-SHSS341
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SMT semi-automatic pick and place machine with Dispenser
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SMT X-Ray Intelligent Item Counting Machine
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High-temperature Industrial Ovens 250°C to 500°C Industrial Drying Ovens Intelligent Constant Temperature Industrial Ovens
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Wave Soldering In-Board feeder machine QJ350-BI
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PCB drying cabinet 240L
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Automatic coating robot
