Stop Outsourcing Small-Batch PCBs: Build Your Line with Semiautomatic Pick and Place

Tight on budget, short on factory space, or simply looking to streamline your small-batch PCB production? You’re not alone. For startups, R&D teams, and niche electronics makers, a compact PCB production line isn’t just a cost-cutting choice—it’s the key to turning circuit board designs into tangible products fast, without the hassle of outsourcing or scaling unnecessarily.Let’s dive into how a small-scale setup can revolutionize your workflow.

Frameless Screen Printing Machine:

Technical Data
ModelQH3040UC
Workbench Size300*400mm
Max.Printing Size280*380mm
Max.Stencil Size310*410mm
Locating Pin Size1.0/1.5/2.0/2.5/3.0mm
PCB Thickness0-20mm
XYZ Axis Adjustment15mm
Repeatability Precision±0.01mm
Location ModeShape or Benchmark Hole
Outline SizeL620*W380*H300mm
Weight24KG

Function:

Completes the PCB solder paste printing process, precisely applying solder paste to PCB pads to lay the foundation for subsequent component placement and soldering.

Advantages:

Compact size (L620W380H300mm, only 24KG) saves space; repeat positioning accuracy of 0.01mm ensures precise printing; supports PCBs from 0-20mm thickness for broad adaptability; 15mm adjustable XYZ axes accommodate varying dimensions and positioning requirements (shape/reference hole alignment), making it suitable for small-batch production and prototyping scenarios.

Semiautomatic SMT Pick and Place

Function:

Rapidly and precisely places SMT components onto pre-solder-pasted PCB locations, bridging the screen printing and reflow soldering processes.

Advantages:

Suited for low-volume, high-variety production and prototyping; accommodates engineering changes; 360° rotating component holder stores 90 types of parts; 16 tape holders accommodate various component sizes; Stable X/Y-axis movement ensures precise placement; SMT-402 includes dispensing functionality for irregularly shaped components; Scalable through parallel operation for low-investment capacity expansion (20-50 pcs/min); Portable design (22 kg).

Small reflow soldering

Small reflow soldering

Function:

Precisely controls heating temperature (0°C-280°C) to melt and solidify solder paste on PCBs, achieving reliable component-to-PCB soldering for finished assembly.

Advantages:

Desktop-sized design (68.4×50.4×22.5cm) for minimal footprint; Maximum soldering area of 400x600mm accommodates small PCBs; Adjustable cycle time from 1-8 minutes optimizes efficiency for small-batch production; Dual voltage compatibility (110V/220V) ensures flexible operation with moderate power consumption (2500W).

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