Selective Desktop Wave Soldering QSO-300B

Description

Function
By precisely controlling the wave soldering head, selective soldering can be performed on local solder joints of the circuit board. Specific soldering areas, time and temperature can be set to meet the soldering needs of small batches and multiple varieties of circuit boards.

Advantages

Efficient and flexible:

Replaces traditional whole-board soldering, reduces solder waste and secondary processing, and is suitable for sample development, small-batch production or rework scenarios.


Precise temperature control:

Avoids damage to sensitive components caused by high temperature of the whole board, improves soldering yield and component reliability.


Easy to operate:

Desktop-level equipment takes up little space, and the program settings are intuitive, reducing labor costs and technical barriers.

SpecificationsParameter
Overall Dimensions1100L*790W*1500H(mm)
Machine frameSteel structure+baking paint
Machine appearanceOpen-type
Board-taking and
-placing method
Manual taking and placing
Operating height900±20mm
WeightApprox.280KG
Power supply1φ 220V 50/60HZ
Total power3KW
Welding real-time monitoringStandard configuration
Programming methodsPicture programming,Gerber document,visual teaching programming,
etc.
PCB parameter
PCB sizeMin:30(L)*30(W);Max:350(L)*250(W)(mm)
Top component heightMax280mm
Bottom component heightMax30mm
PCB WeightMax5Kg
PCB Process Edge>3mm
Selective spray system
Spray movement modePCB movement in XYZ axis
Spray flux volume1L
Spray flux add modeManual
Spray nozzle typeNeedle
Spray cycle time1 Sec/soldered dot(The minimum spray time can be set to 0.1 seconds)
Spray movement precision0.05mm
Spray flow controlPressure gage +flow valve
Spray travel speed0-400 mm per second adjustable
Selective Soldering System
Welding movement modePCB movement in XYZ axis
Movement modeServo motor +linear rail
Solder feeding modeManual
Solder capacity15KG
Solder melting time45min
Solder power1.2KW
Solder nozzle sizeStandard with 5 solder tips(3-64-86-108-1210-14)
Solder cycle time1~6 Sec/soldered dot
Temperature control modePID+SSR
Temperature setting rangeMax350℃
Temperature accuracy±2℃
Waver heightMax 0-8mm
Welding precision±0.1mm
welding moving speed0-4000mm adjustable
Solder dross0.2Kg/8H(Not N2 protection);0.01Kg/8H(N2 protection)
N2 protection system
N2 protection modeNozzle and solder pot
N2 consumption1.5M³/h(Nitrogen  concentration>99.999%)
N2 flow controlGlass rotor flowmeter
Exhaust system
Top cover exhaustCustomer supply
Exhaust quantity1 PCS