Description
Function
Through the high-speed moving precision welding head, non-contact local welding is performed on the specified solder joints/areas of the circuit board, replacing the whole board welding, which is suitable for the rapid welding and rework of large-scale, high-precision electronic components.
Advantages
High efficiency and high speed:
fast welding speed, support for mass production, and greatly improve production capacity.
Precise and controllable:
high positioning accuracy, can set personalized welding parameters (temperature, time, solder amount), reduce the risk of thermal damage.
Flexible and economical:
offline operation does not occupy the production line, adapts to multiple varieties of changeover, saves solder and labor costs.
Yield improvement:
local welding avoids the influence of high temperature on the whole board, improves the reliability of solder joints and product yield.
| Specifications | Parameter |
| Overall Dimensions | 1430L*1000W*1650H(mm) |
| Machine frame | Steel structure+baking paint |
| Operating height | 900±20mm |
| Weight | Approx.380KG |
| Power supply | 1φ 220V 50/60HZ |
| Total power | 7.5KW |
| Taking and placing board method | Manual taking and placing |
| Machine appearance | Closed-type |
| Programming methods | Picture programming,Gerber document,video teaching programming, etc |
| Welding real-time monitoring | Standard configuration |
| Operating mode | PCB board XYZ axis movement |
| PCB parameter | |
| PCB size | Min:30(L)*30(W);Max:400(L)*300(W)(mm) |
| Top component height | Max100mm |
| Bottom component height | Max30mm |
| PCB Weight | Max10Kg |
| PCB Process Edge | >3mm |
| Selective spray system | |
| Spray movement mode | PCB movement in XYZ axis |
| Spray flux volume | 1L |
| Spray flux add mode | Manual |
| Spray nozzle type | Needle |
| Spray cycle time | 1 Sec/soldered dot(The minimum spray time can be set to 0.1 seconds) |
| Spray movement precision | ±0.1mm |
| spray moving speed | 0-500mm adjustable |
| Spray flow control | pressure gage +flow valve |
| Preheating system | |
| Preheating method | bottom heat |
| Heating form | Infrared spotlight heating |
| Temperature control | Heating rate ratio and time |
| Selective Soldering System | |
| Welding movement mode | PCB movement in XYZ |
| Movement mode | Servo motor +linear rail |
| Number of soldering heads | One |
| Solder feeding mode | Manual |
| Solder capacity | 15KG |
| Solder melting time | 45min |
| Solder power | 1.2KW |
| Solder nozzle size | Standard with 5 solder tips(3-64-86-108-1210-14) |
| Solder cycle time | 1~5Sec/soldered dot |
| Temperature control mode | PID+SSR |
| Temperature setting range | Max350℃ |
| Temperature accuracy | ±2℃ |
| Waver height | Max 0-8mm |
| Welding precision | ±0.1mm |
| Solder dross | 0.2Kg/8H(Not N2 protection);0.01Kg/8H(N2 protection) |
| N2 protection system | |
| N2 protection mode | Nozzle and solder pot |
| N2 consumption | 1.5M³/h(Nitrogen concentration>99.999%) |
| N2 flow control | Glass rotor flowmeter |
