Description
Function
By precisely controlling the wave soldering head, selective soldering can be performed on local solder joints of the circuit board. Specific soldering areas, time and temperature can be set to meet the soldering needs of small batches and multiple varieties of circuit boards.
Advantages
Efficient and flexible:
Replaces traditional whole-board soldering, reduces solder waste and secondary processing, and is suitable for sample development, small-batch production or rework scenarios.
Precise temperature control:
Avoids damage to sensitive components caused by high temperature of the whole board, improves soldering yield and component reliability.
Easy to operate:
Desktop-level equipment takes up little space, and the program settings are intuitive, reducing labor costs and technical barriers.
Specifications | Parameter |
Overall Dimensions | 1100L*790W*1500H(mm) |
Machine frame | Steel structure+baking paint |
Machine appearance | Open-type |
Board-taking and -placing method | Manual taking and placing |
Operating height | 900±20mm |
Weight | Approx.280KG |
Power supply | 1φ 220V 50/60HZ |
Total power | 3KW |
Welding real-time monitoring | Standard configuration |
Programming methods | Picture programming,Gerber document,visual teaching programming, etc. |
PCB parameter | |
PCB size | Min:30(L)*30(W);Max:350(L)*250(W)(mm) |
Top component height | Max280mm |
Bottom component height | Max30mm |
PCB Weight | Max5Kg |
PCB Process Edge | >3mm |
Selective spray system | |
Spray movement mode | PCB movement in XYZ axis |
Spray flux volume | 1L |
Spray flux add mode | Manual |
Spray nozzle type | Needle |
Spray cycle time | 1 Sec/soldered dot(The minimum spray time can be set to 0.1 seconds) |
Spray movement precision | 0.05mm |
Spray flow control | Pressure gage +flow valve |
Spray travel speed | 0-400 mm per second adjustable |
Selective Soldering System | |
Welding movement mode | PCB movement in XYZ axis |
Movement mode | Servo motor +linear rail |
Solder feeding mode | Manual |
Solder capacity | 15KG |
Solder melting time | 45min |
Solder power | 1.2KW |
Solder nozzle size | Standard with 5 solder tips(3-64-86-108-1210-14) |
Solder cycle time | 1~6 Sec/soldered dot |
Temperature control mode | PID+SSR |
Temperature setting range | Max350℃ |
Temperature accuracy | ±2℃ |
Waver height | Max 0-8mm |
Welding precision | ±0.1mm |
welding moving speed | 0-4000mm adjustable |
Solder dross | 0.2Kg/8H(Not N2 protection);0.01Kg/8H(N2 protection) |
N2 protection system | |
N2 protection mode | Nozzle and solder pot |
N2 consumption | 1.5M³/h(Nitrogen concentration>99.999%) |
N2 flow control | Glass rotor flowmeter |
Exhaust system | |
Top cover exhaust | Customer supply |
Exhaust quantity | 1 PCS |