Today author from QiHe smt pick and place machine sharing you with pcb layout of Controllability and Electromagnetic Compatibility Design of High Speed PCB .High-speed circuit planning is a very complex planning process,
When planning high-speed circuits, there are many elements that need to be considered.
These elements are sometimes antagonistic to each other.
If the layout of high-speed equipment is close to each other, although the delay can be reduced,
However, crosstalk and significant thermal effects may occur.
Therefore, in planning, it is necessary to weigh various elements and make a comprehensive compromise consideration;
It not only meets the planning requirements, but also reduces the complexity of planning.
This article analyzes the PCB layout, layout and high-speed PCB planning in three parts.
Introduce the controllability and electromagnetic compatibility planning of high-speed PCB.
In PCB design, wiring is an important step to complete product design.
It can be said that the previous preparatory work was done for it,
In the whole PCB, the design process of wiring is most limited, the technology is most detailed, and the workload is most heavy.
PCB wiring includes single-sided wiring, double-sided wiring and multi-layer wiring.
There are also two ways of routing: active routing and interactive routing. Before active routing,
It is possible to pre-route the more stringent lines interactively,
The edges of the input terminal and the output terminal should not be adjacent to each other in parallel to avoid reflection interference.
If necessary, the ground wire should be added for isolation, and the wiring of two adjacent layers should be perpendicular to each other.
Parasitic coupling simply occurs in parallel.
The routing rate of active routing depends on a good layout,
The wiring rules can be pre-set, including the number of bends of the trace, the number of via holes, and the number of steps.
Generally, the exploratory warp line is carried out first, and the short lines are quickly connected, and then the labyrinth wiring is carried out.
First optimize the overall wiring path of the wiring to be laid,
It can disconnect the routed wires as required.
And try to re-route to improve the overall effect.
I feel that through holes are not suitable for the current high-density PCB planning.
It wastes many valuable routing channels, to deal with this contradiction,
Blind hole and buried hole technology appeared, which not only completed the effect of via hole,
It also saves a lot of wiring channels to make the wiring process more convenient.
smoother, more perfect,
The PCB board planning process is a complex yet simple process,
To get a good grip on it,
It is still necessary for the majority of electronic engineering designers to understand by themselves,
In order to get the truth in it.
Today we discuss above issues.You are welcome to express your thoughts in the comments.
Next time we will continue to discuss other aspects.If you need SMT equipment, inquiry is also very welcome.
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WHAT IS SMT pick and place machine？
SMT (Surface Mounted Technology) is a comprehensive system engineering technology, which covers substrates, design, equipment, components, assembly processes, production accessories and management. When it comes to SMT pick and place machines, the automatic SMT production line requires automatic loading and unloading machine, automatic solder paste printing machine, placement machine, reflow soldering machine, AOI inspection equipment, connecting table, etc. For these SMT assembly line equipment, Qihe SMT can offer you machines in prototype SMT line, small SMT production line, mass production SMT line at low SMT line cost. Contact us now if you are interested.
WHAT IS SMT PROCESS？
There are mainly three steps in SMT assembly line process flow： solder paste printing, components placement and reflow soldering.
- Solder Paste Printing
Its function in SMT line process is to print the solder-free paste on the pads of the PCB to prepare for the soldering of the components. The equipment used is a screen printing machine, located at the forefront of the SMT production line.
- Components Placement
Its function is to accurately install the surface mount components on the fixed position of the PCB. The equipment used is a placement machine, located behind the screen printing machine in the SMT production line.
- Reflow Soldering
Its function in SMT manufacturing line is to melt the solder paste so that the surface mount components and the PCB board are firmly bonded together. The equipment used is a reflow oven, located behind the placement machine in the fully automatic SMT production line.
WHAT IS SMT ASSEMBLY LINE？
With the development of technology, future electronic products will be lighter, smaller and thinner. Traditional assembly technology can no longer meet the requirements of high-precision and high-density assembly. A new type of PCB assembly technology-SMT (Surface Mount Technology) has emerged. SMT Assembly is the use of automated machines to assemble electronic components on the surface of the circuit board. Its density, high speed, standardization and other characteristics occupies an absolute advantage in the field of circuit assembly technology. In addition, SMT assembly has a wide range of uses.