Today author from qihe smt pick and place machine,chip mounter sharing you with some tips about how to detect circuit board component failure .
Most components that fail on a board are single failures of many components. Yishunde Electric has some methods here:
The research method is to trigger the fault of the electronic circuit through the human body. This is the most simple and most safe method, and it is also the first step in the normal viewing process of various instruments and equipment.
The measurement method is the most widely used and most useful method in defect detection. According to the characteristics of electrical parameters, it can be divided into resistance method, voltage method, current method, logic situation method and waveform method.
Signal transmission circuits, including signal collection (signal seizure), signal processing (signal expansion, conversion, filtering, isolation, etc.) and signal function circuits, occupy a large share in modern electronic circuits. The key to checking this circuit is to track the transmission link of the signal.
Substitution is a method of examining normal components, circuits, or components that have the same standard function, rather than those in the circuit that are suspect, and then distinguish the defective address. It is also one of the most commonly used and most useful methods in circuit debugging and correction.
Sometimes it is impossible to determine the location of the defect by means of various surveys and experiments, but the method of comparison, the method of comparison without confusion, can surprise people.
Computer intelligent automatic viewing:
The use of powerful computer data processing capabilities and modern sensor technology can make circuit viewing more vivid and intelligent. At that time, various computers and computer equipment were used more widely and at a higher level. There are many circuit board elements and components that make up the downside. Choosing useful viewing options can save time and effort.
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WHAT IS SMT ASSEMBLY LINE？
With the development of technology, future electronic products will be lighter, smaller and thinner. Traditional assembly technology can no longer meet the requirements of high-precision and high-density assembly. A new type of PCB assembly technology-SMT (Surface Mount Technology) has emerged. SMT Assembly is the use of automated machines to assemble electronic components on the surface of the circuit board. Its density, high speed, standardization and other characteristics occupies an absolute advantage in the field of circuit assembly technology. In addition, SMT assembly has a wide range of uses.
WHAT IS SMT pick and place machine？
SMT (Surface Mounted Technology) is a comprehensive system engineering technology, which covers substrates, design, equipment, components, assembly processes, production accessories and management. When it comes to SMT pick and place machines, the automatic SMT production line requires automatic loading and unloading machine, automatic solder paste printing machine, placement machine, reflow soldering machine, AOI inspection equipment, connecting table, etc. For these SMT assembly line equipment, Qihe SMT can offer you machines in prototype SMT line, small SMT production line, mass production SMT line at low SMT line cost. Contact us now if you are interested.
WHAT IS SMT PROCESS？
There are mainly three steps in SMT assembly line process flow： solder paste printing, components placement and reflow soldering.
- Solder Paste Printing
Its function in SMT line process is to print the solder-free paste on the pads of the PCB to prepare for the soldering of the components. The equipment used is a screen printing machine, located at the forefront of the SMT production line.
- Components Placement
Its function is to accurately install the surface mount components on the fixed position of the PCB. The equipment used is a placement machine, located behind the screen printing machine in the SMT production line.
- Reflow Soldering
Its function in SMT manufacturing line is to melt the solder paste so that the surface mount components and the PCB board are firmly bonded together. The equipment used is a reflow oven, located behind the placement machine in the fully automatic SMT production line.