As a Manufacturing Process Engineer for printed circuit board assemblies (PCBA), your primary role is to develop and document manufacturing processes for electronic assemblies which yield reliable high-quality assemblies at the lowest possible cost. To reduce the ripple of switching power supply in pcb assembly, we must work hard in the following three aspects:
Energy storage inductor
The larger the Q value of the energy storage inductor at the operating frequency, the better. Many people only pay attention to the inductance. In fact, the influence of the Q value is much greater. As long as the inductance meets the requirements, it is allowed to fluctuate in a wide range.
The ESR and ESL of the filter capacitor are very important parameters. The lower the better, the pursuit of capacity alone is far from enough. Of course, on the premise of meeting sufficiently low ESR and ESL, a larger capacity is better. The filter capacitor of the switching power supply is preferably a combination of X7R or X5R capacitors and tantalum electrolytics. The ripple can be slightly relaxed by using Y5V capacitors and aluminum electrolytics (low ESL type) with a thin and tall appearance.
The PCB design of the switching power supply is very important. When the first two conditions are met, if the ripple parameter still does not reach the value stated in the manual, the problem can definitely be on the PCB, the sampling of the switching power supply chip and the filter circuit. The design is very particular. PCB distribution parameters will lead to adjustment errors or poor filtering efficiency. In severe cases, it may even lead to self-excitation (usually occurs under a specific load intensity), so it has to be checked. The principle is that the sampling loop and filter loop should be as close as possible to the switching power supply IC, and the PCB wiring should not be too long or too thin. The same principle applies to similar energy storage inductors, but the impact is slightly smaller. Unfavorable layout and wiring are equivalent to reducing the Q of the inductor. value.
The last thing to say is that because of the different internal circuit design of switching power supply IC, the ripple index is also different. In most cases, it is easy to obtain lower ripple with high switching frequency, but the price and the requirements for peripheral components are relatively higher. Therefore, it is necessary to choose reasonably according to the needs, as long as it is enough, otherwise unnecessary costs will be paid. Careful reading and understanding of the device manual is the first step.Read more: How to Reduce Ripple of Switching Power Supply?
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What is SMT in engineering?
Surface mount technology is a part of the electronic assembly that deals with the mounting of electronic components to the surface of a PCB. Electronic components mounted this way are called surface-mounted devices (SMD). SMT was developed to minimize manufacturing costs while making efficient use of board space.Qihe SMT company develops and produces all kinds of SMT equipment suitable for world wide market, including pnp machine,reflow oven,stencil printer,pcb handling machines,and other products.
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What is SMT in programming?
Offline Automated Programming vs Inline SMT Programming
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SMT (Surface Mounted Technology) is a comprehensive system engineering technology, which covers substrates, design, equipment, components, assembly processes, production accessories and management. When it comes to SMT pick and place machines, the automatic SMT production line requires automatic loading and unloading machine, automatic solder paste printing machine, placement machine, reflow soldering machine, AOI inspection equipment, conveyor,connecting table, etc. For these SMT assembly line equipment, Qihe SMT can offer you machines in prototype SMT line, small SMT production line, mass production SMT line at low SMT line cost. Contact us now if you are interested.
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WHAT IS SMT ASSEMBLY LINE？
With the development of technology, future electronic products will be lighter, smaller and thinner. Traditional assembly technology can no longer meet the requirements of high-precision and high-density assembly. A new type of PCB assembly technology-SMT (Surface Mount Technology) has emerged. SMT Assembly is the use of automated machines to assemble electronic components on the surface of the circuit board. Its density, high speed, standardization and other characteristics occupies an absolute advantage in the field of circuit assembly technology. In addition, SMT assembly has a wide range of uses.