Today author from QiHe smt pick and place machine tell you about it with you The conventional placement machine is transmitted to the placement machine through the parameters we set in the system, and the placement machine uses the suction nozzle to absorb or place the current material. Many of us often encounter such a problem. It is because the suction effect of the nozzle of the placement machine has deteriorated, or the material cannot be absorbed at all. What is the reason? How can we solve it? Don’t worry, tvm802a multi-function placement machine manufacturer answer for you
Phenomenon: During the operation of the placement machine, the suction nozzle cannot always be sucked in. Or it can be sucked in front, but cannot suck out after the machine is running. Common reasons:
1. No negative pressure: This may be due to a problem with the air circuit or the vacuum generator, resulting in no negative pressure. Solution: Check the gas circuit and vacuum generator, if there is a problem, repair it.
2. The negative pressure solenoid valve is not opened: If there is no problem with the negative pressure, it may be because the negative pressure solenoid valve is not opened, so the placement machine cannot suck in the material. Solution: Check whether the negative pressure solenoid valve is normally opened.
3. The suction nozzle is blocked: If there is no problem with the air circuit, vacuum generator and negative pressure solenoid valve, but the placement machine still cannot suck out the material, it is probably because the suction nozzle is blocked. Solution: If the suction port is blocked and the placement machine cannot suck the material, the suction port is required.Read more: How To Solve The Poor Suction Effect Of The Placement Machine
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QHSMT is an enterprise specializing in the production of SMT equipment, like pick and place machine ，reflow oven，stencil printer ，smt pick and place machine,pnp,pick&place,pcb assembly,smd chip shooter,pnp machine,chip mounter,smt line,welcome to send inquiry
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WHAT IS SMT ASSEMBLY LINE？
With the development of technology, future electronic products will be lighter, smaller and thinner. Traditional assembly technology can no longer meet the requirements of high-precision and high-density assembly. A new type of PCB assembly technology-SMT (Surface Mount Technology) has emerged. SMT Assembly is the use of automated machines to assemble electronic components on the surface of the circuit board. Its density, high speed, standardization and other characteristics occupies an absolute advantage in the field of circuit assembly technology. In addition, SMT assembly has a wide range of uses.
WHAT IS SMT pick and place machine？
SMT (Surface Mounted Technology) is a comprehensive system engineering technology, which covers substrates, design, equipment, components, assembly processes, production accessories and management. When it comes to SMT pick and place machines, the automatic SMT production line requires automatic loading and unloading machine, automatic solder paste printing machine, placement machine, reflow soldering machine, AOI inspection equipment, connecting table, etc. For these SMT assembly line equipment, Qihe SMT can offer you machines in prototype SMT line, small SMT production line, mass production SMT line at low SMT line cost. Contact us now if you are interested.
WHAT IS SMT PROCESS？
There are mainly three steps in SMT assembly line process flow： solder paste printing, components placement and reflow soldering.
- Solder Paste Printing
Its function in SMT line process is to print the solder-free paste on the pads of the PCB to prepare for the soldering of the components. The equipment used is a screen printing machine, located at the forefront of the SMT production line.
- Components Placement
Its function is to accurately install the surface mount components on the fixed position of the PCB. The equipment used is a placement machine, located behind the screen printing machine in the SMT production line.
- Reflow Soldering
Its function in SMT manufacturing line is to melt the solder paste so that the surface mount components and the PCB board are firmly bonded together. The equipment used is a reflow oven, located behind the placement machine in the fully automatic SMT production line.