What can we do in SMT environmental development? the PCB circuit board !- It is natural for PCB circuit boards to develop towards environmental protection. We all know that the development trend of modern electronic equipment is turning to miniaturization, light weight and multi-function, and corresponding to the global environmental protection promotion, environmental protection is the follow-up direction of development. As a basis, printed circuit boards should naturally move closer to these directions, and the materials used in printed circuit boards should of course meet the needs of these aspects.So,qihe smt pick and place machine,pick and place robot will tell you about it today .
Environmentally friendly materials
Environmentally friendly products are the need for sustainable development, and environmentally friendly printed boards require environmentally friendly materials. For the copper clad laminate, the main material of the printed board, the poisonous polybrominated biphenyl (PBB) and polybrominated diphenyl ether (PBDE) are prohibited in accordance with the EU RoHS regulations, which involves the cancellation of the bromine-containing flame retardant for the copper clad laminate. agent. At present, the advanced countries in the world have begun to adopt a large number of halogen-free copper clad laminates, while the domestic halogen-free copper clad laminate products have only been successfully developed in large enterprises with foreign capital. In the production of copper clad laminates, it failed to meet the requirements of environmental protection bans.
In addition to being non-toxic, environmentally friendly products are also required to be recycled and reused after they are discarded. Therefore, the insulating resin layer of the printed board base material is considered to be changed from thermosetting resin to thermoplastic resin, which is convenient for the recycling of waste printed boards. After heating, the resin is separated from the copper foil or metal parts, and each can be recycled and reused. In this regard, it has been reported that the high-density interconnection printed board that has been successfully applied to the build-up method has been successfully developed abroad, but there is no news in China.
The solderability coating material on the surface of the printed board, the most traditional application is tin-lead alloy solder, and now the EU RoHS decree bans lead, and the substitute is tin, silver or nickel/gold plating. Foreign electroplating chemical companies have developed and launched electroless nickel/immersion gold, electroless tin, and electroless silver plating chemicals in the past few years, but no domestic suppliers of the same type have launched similar new materials.
Cleaner production materials
Cleaner production is an important means to achieve sustainable development of environmental protection, and clean production needs to be supplemented by cleaner production materials. The traditional production method of printed boards is the subtraction method of copper foil etching to form patterns, which consumes chemical etching solutions and generates a large amount of waste water. Foreign countries have been developing and applying copper-free catalyzed laminate materials, using the addition method of direct chemical copper deposition to form circuit patterns, which can save chemical corrosion and reduce waste water, which is conducive to cleaner production. The development of such laminate materials for additive process is still blank in China.
Cleaner inkjet printing wire pattern technology without chemical and water cleaning is a dry production process. The key to this technology is inkjet printers and conductive paste materials. Now nanoscale conductive paste materials have been successfully developed abroad, making inkjet printing technology practical. This is a revolutionary change of printed boards towards cleaner production. There is still a lack of micron-scale conductive paste materials that meet the use of printed board cross-lines and through holes in China, and the nano-scale conductive paste materials are even more invisible.
In clean production, we also look forward to cyanide-free gold electroplating process materials, chemical copper deposition process materials that do not use harmful formaldehyde as a reducing agent, etc. It is necessary to speed up the development and application of printed board production.
high performance materials
With the digital development of electronic equipment, there are also higher requirements for the performance of supporting printed boards. At present, there are requirements such as low dielectric constant, low moisture absorption, high temperature resistance, high dimensional stability, etc. The key to meeting these requirements is to use high-performance copper clad laminate materials. In addition, in order to realize the thinning and high density of printed boards, copper clad laminate materials such as thin fiber cloth and thin copper foil are required.
The key to highlighting the light, thin and flexible characteristics of flexible printed boards is the flexible copper clad laminate material. Many digital electronic devices require the application of high-performance flexible copper clad laminate materials. At present, the direction of improving the performance of flexible copper clad laminates is adhesive-free flexible copper clad laminate materials.
IC package carrier board is already a branch of printed board, and now it is widely used in new IC packages represented by BGA and CSP. The IC package carrier board uses a thin organic substrate material with good high frequency performance, high heat resistance and dimensional stability. High-performance materials have been introduced and applied abroad, and are further improved and new materials are produced. Compared with domestic counterparts, many high-performance materials are still blank.
In order to make China a big and powerful country in the printed circuit industry, there is an urgent need for printed board materials made in China.
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Classification of printed circuit board materials
There are many kinds of materials used in the production of printed circuit boards, which can be divided into two categories: main materials and auxiliary materials according to their applications. Main material: The raw material that becomes part of the product, such as copper clad laminate, solder resist ink, marking ink, etc., also known as physicochemical materials. Auxiliary materials: materials consumed in the production process, such as photoresist dry film, etching solution, electroplating solution, chemical cleaning agent, drilling pad, etc., also known as non-physical materials.
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WHAT IS SMT pick and place machine？
SMT (Surface Mounted Technology) is a comprehensive system engineering technology, which covers substrates, design, equipment, components, assembly processes, production accessories and management. When it comes to SMT pick and place machines, the automatic SMT production line requires automatic loading and unloading machine, automatic solder paste printing machine, placement machine, reflow soldering machine, AOI inspection equipment, connecting table, etc. For these SMT assembly line equipment, Qihe SMT can offer you machines in prototype SMT line, small SMT production line, mass production SMT line at low SMT line cost. Contact us now if you are interested.
WHAT IS SMT ASSEMBLY LINE？
With the development of technology, future electronic products will be lighter, smaller and thinner. Traditional assembly technology can no longer meet the requirements of high-precision and high-density assembly. A new type of PCB assembly technology-SMT (Surface Mount Technology) has emerged. SMT Assembly is the use of automated machines to assemble electronic components on the surface of the circuit board. Its density, high speed, standardization and other characteristics occupies an absolute advantage in the field of circuit assembly technology. In addition, SMT assembly has a wide range of uses.